| Naslov: | Challenges for large-scale deployment of WBG in power electronics |
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| Avtorji: | ID Lavrič, Henrik (Avtor) ID Zajec, Peter (Avtor) ID Drobnič, Klemen (Avtor) ID Rihar, Andraž (Avtor) ID Ambrožič, Vanja (Avtor) ID Vončina, Danijel (Avtor) ID Nemec, Mitja (Avtor) |
| Datoteke: | PDF - Predstavitvena datoteka, prenos (4,25 MB) MD5: D97765CD983EE3FF1E63F844D9E4ABD1
URL - Izvorni URL, za dostop obiščite https://ojs.midem-drustvo.si/index.php/InfMIDEM/article/view/2062
URL - Izvorni URL, za dostop obiščite https://ojs.midem-drustvo.si/index.php/InfMIDEM/article/view/2062
To gradivo ima še več datotek. Celoten seznam je na voljo
spodaj.
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| Jezik: | Angleški jezik |
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| Tipologija: | 1.01 - Izvirni znanstveni članek |
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| Organizacija: | MIDEM - Strokovno društvo za mikroelektroniko, elektronske sestavne dele in materiale
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| Povzetek: | As the demand for efficient and high-performance power electronic devices continues to grow, wide bandgap (WBG) semiconductors have emerged as a promising solution due to their superior characteristics. However, realizing their full potential requires not only the development of advanced semiconductor materials but also the optimization of packaging techniques. This paper examines the crucial role of packaging in leveraging the benefits of WBG devices, with a particular focus on mitigating inductance and addressing other critical concerns. Drawing from previous research and discussions, we explore various strategies to minimize inductance effects, enhance thermal management, ensure reliability, and optimize electrical performance. Through an interdisciplinary approach that encompasses electrical engineering, materials science, and mechanical engineering principles, this paper highlights the latest advancements in WBG device packaging, providing valuable insights for researchers and engineers working towards more efficient and reliable power electronic systems. |
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| Ključne besede: | wide bandgap, semiconductors, power electronics, packaging, design |
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| Status publikacije: | Objavljeno |
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| Verzija publikacije: | Objavljena publikacija |
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| Datum objave: | 01.01.2025 |
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| Leto izida: | 2025 |
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| Št. strani: | str. 3-23 |
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| Številčenje: | Vol. 55, no. 1 |
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| PID: | 20.500.12556/DiRROS-30223  |
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| UDK: | 621.3 |
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| ISSN pri članku: | 0352-9045 |
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| DOI: | 10.33180/InfMIDEM2025.101  |
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| COBISS.SI-ID: | 228550915  |
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| Opomba: | Besedilo v angl.; |
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| Datum objave v DiRROS: | 18.06.2026 |
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| Število ogledov: | 121 |
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| Število prenosov: | 120 |
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| Metapodatki: |  |
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