| Title: | Challenges for large-scale deployment of WBG in power electronics |
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| Authors: | ID Lavrič, Henrik (Author)
ID Zajec, Peter (Author)
ID Drobnič, Klemen (Author)
ID Rihar, Andraž (Author)
ID Ambrožič, Vanja (Author)
ID Vončina, Danijel (Author)
ID Nemec, Mitja (Author) |
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| Files: |  PDF - Presentation file, download (4,25 MB)
MD5: D97765CD983EE3FF1E63F844D9E4ABD1
 URL - Source URL, visit https://ojs.midem-drustvo.si/index.php/InfMIDEM/article/view/2062
URL - Source URL, visit https://ojs.midem-drustvo.si/index.php/InfMIDEM/article/view/2062
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| Language: | English |
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| Typology: | 1.01 - Original Scientific Article |
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| Organization: |  MIDEM - Society for Microelectronics, Electronic Components and Materials
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| Abstract: | As the demand for efficient and high-performance power electronic devices continues to grow, wide bandgap (WBG) semiconductors have emerged as a promising solution due to their superior characteristics. However, realizing their full potential requires not only the development of advanced semiconductor materials but also the optimization of packaging techniques. This paper examines the crucial role of packaging in leveraging the benefits of WBG devices, with a particular focus on mitigating inductance and addressing other critical concerns. Drawing from previous research and discussions, we explore various strategies to minimize inductance effects, enhance thermal management, ensure reliability, and optimize electrical performance. Through an interdisciplinary approach that encompasses electrical engineering, materials science, and mechanical engineering principles, this paper highlights the latest advancements in WBG device packaging, providing valuable insights for researchers and engineers working towards more efficient and reliable power electronic systems. |
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| Keywords: | wide bandgap, semiconductors, power electronics, packaging, design |
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| Publication status: | Published |
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| Publication version: | Version of Record |
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| Publication date: | 01.01.2025 |
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| Year of publishing: | 2025 |
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| Number of pages: | str. 3-23 |
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| Numbering: | Vol. 55, no. 1 |
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| PID: | 20.500.12556/DiRROS-30223  |
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| UDC: | 621.3 |
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| ISSN on article: | 0352-9045 |
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| DOI: | 10.33180/InfMIDEM2025.101 |
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| COBISS.SI-ID: | 228550915 |
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| Note: | Besedilo v angl.; |
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| Publication date in DiRROS: | 18.06.2026 |
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| Views: | 120 |
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| Downloads: | 118 |
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