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Challenges for large-scale deployment of WBG in power electronicsHenrik Lavrič,
Peter Zajec,
Klemen Drobnič,
Andraž Rihar,
Vanja Ambrožič,
Danijel Vončina,
Mitja Nemec, 2025, izvirni znanstveni članek
Povzetek: As the demand for efficient and high-performance power electronic devices continues to grow, wide bandgap (WBG) semiconductors have emerged as a promising solution due to their superior characteristics. However, realizing their full potential requires not only the development of advanced semiconductor materials but also the optimization of packaging techniques. This paper examines the crucial role of packaging in leveraging the benefits of WBG devices, with a particular focus on mitigating inductance and addressing other critical concerns. Drawing from previous research and discussions, we explore various strategies to minimize inductance effects, enhance thermal management, ensure reliability, and optimize electrical performance. Through an interdisciplinary approach that encompasses electrical engineering, materials science, and mechanical engineering principles, this paper highlights the latest advancements in WBG device packaging, providing valuable insights for researchers and engineers working towards more efficient and reliable power electronic systems.
Ključne besede: wide bandgap, semiconductors, power electronics, packaging, design
Objavljeno v DiRROS: 18.06.2026; Ogledov: 207; Prenosov: 275
Celotno besedilo (4,53 MB)
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