Mode I fracture of beech-adhesive bondline at three different temperaturesJaka Gašper Pečnik
, Andreja Pondelak
, Michael David Burnard
, Václav Sebera
, 2022, original scientific article
Abstract: Single edge-notched three-point bending tests (SEN-TPB) for mode I were utilized to experimentallyevaluate fracture properties of adhesive bondlines in European beech (Fagus SylvaticaL.). Thebondline was examined at two anatomical planes with TR and RT orientation and at control andtwo elevated temperatures (70°C and 140°C). Among epoxy (EPI), melamine-urea formaldehyde (MUF), and polyurethane (PUR) adhesives, the highest average critical energyGcwith 0.80 N/mmand fracture energyGfwith 1079.4 N/mm were obtained for EPI in the TR plane and understandard climate conditions (20°C/65% relative humidity), followed by MUF (Gc= 0.50 N/mm andGf= 620 N/mm) and PUR (Gc= 0.25 N/mm andGf= 290.9 N/mm), respectively. PUR was leasteffected by elevated temperature, and no significant differences forGcandGfbetween TR and RTbondline orientations were found for MUF and PUR treated at 20°C/65% relative humidity whilecomparisons between other factors varied significantly. Treatment of specimens at elevatedtemperatures resulted in reduced fracture performance regardless of wood grain orientation orthe adhesive system.
Keywords: crack, fracture, grain orientation, temperature, European Beech, odprti dostop
Published in DiRROS: 03.05.2023; Views: 54; Downloads: 43
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