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<rdf:RDF xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#" xmlns:dc="http://purl.org/dc/elements/1.1/"><rdf:Description rdf:about="https://dirros.openscience.si/IzpisGradiva.php?id=23268"><dc:title>Dataset for the article Effect of sulfide in a 0.2 M NaCl solution on copper and pre-oxidized copper in oxic conditions</dc:title><dc:creator>Prijatelj,	Klara	(Avtor)
	</dc:creator><dc:creator>Kosec,	Tadeja	(Avtor)
	</dc:creator><dc:subject>copper</dc:subject><dc:subject>pre-oxidized copper</dc:subject><dc:subject>chloride and sulfide environment</dc:subject><dc:subject>electrochemical properties</dc:subject><dc:subject>surface characterization</dc:subject><dc:subject>Raman</dc:subject><dc:subject>cyclic voltammetry</dc:subject><dc:description>This dataset supports the tables and figures in the article Effect of sulfide in a 0.2 M NaCl solution on copper and pre-oxidized copper in oxic conditions Effect of sulfide in a 0.2 M NaCl solution on copper and pre-oxidized copper in oxic conditions (https://doi.org/10.1016/j.surfin.2025.107387). The data set contains experimental data for copper and pre-oxidized copper samples exposed to chloride solution (0.2 M Cl–) with different sulfide concentrations (5·10–6 M SH– and 1·10–4 M SH–) at room temperature (22 ± 2 °C) and elevated temperature (60 °C). Corrosion potential was monitored over a period of 24 hours. After 24 h immersion, electrochemical impedance spectroscopy was performed to observe the properties of the surface film formed on the copper and the pre-oxidized copper. The dataset also includes images of pre-oxidized samples after 24 hours immersion in different solutions, original Raman spectra and Raman images, XPS data and images data from the scanning electron microscope and images of cross-section of samples. The dataset was also used for the model of corroding system (Figure 13)</dc:description><dc:publisher>Zavod za gradbeništvo Slovenije</dc:publisher><dc:date>2025</dc:date><dc:date>2025-08-11 13:36:29</dc:date><dc:type>Neznano</dc:type><dc:identifier>23268</dc:identifier><dc:language>sl</dc:language><dc:rights>© authors, 2025</dc:rights></rdf:Description></rdf:RDF>
